Seaspan Shipyards - Holoship Initiative

Seaspan Shipyards is issuing this call to participate with an Expression of Interest (EOI) in their HoloShip Initiative. The HoloShip Initiative is intended to build independent and integrated solutions that accelerate the market potential from digital twins, digital threads, integrated analytics and real-time sensing for improved competitiveness in the marine industry. 

Seaspan invites participation from the wider marine and digital communities in an Expression of Interest as the first phase of a two-phase process. Selected project concepts from the EOI phase will be invited to submit a full proposal. One or more projects will be selected for funding up to a maximum cumulative total of $2.4M. Pending interest from the community and available funding, additional calls for participation may be issued at a later date. This initiative is being developed under Canada’s National Shipbuilding Strategy’s Value Proposition program.

Deadline: Expressions of Interest must be submitted no later than 14:00 PST on Friday, August 6, 2021 via email to innovation@seaspan.com

Website: https://www.seaspan.com/seaspan-shipyards/access-innovation

Upcoming Deadlines

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August 06, 2022August 06, 2022 *
16:00:00 16:00:00 America/Vancouver Application Deadline: Seaspan Shipyards - Holoship Initiative Seaspan Shipyards is issuing this call to participate with an Expression of Interest (EOI) in their HoloShip Initiative. The HoloShip Initiative is intended to build independent and integrated solutions that accelerate the market potential from digital twins, digital threads, integrated analytics and real-time sensing for improved competitiveness in the marine industry. EOIs are due to Seaspan by 2pm PST on August 6, 2021 and must be submitted via email to innovation@seaspan.com. .
* NOTE: This deadline is an estimate based on previous years, but a confirmed deadline has not yet been published. We will update the deadline when it has been confirmed.

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